<?xml version="1.0" encoding="UTF-8" ?>
<modsCollection xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns="http://www.loc.gov/mods/v3" xmlns:slims="http://slims.web.id" xsi:schemaLocation="http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-3.xsd">
<mods version="3.3" ID="5142">
<titleInfo>
<title><![CDATA[Pengaruh Penggunaan Thermal Pasta Terhadap Panas IC (Integrated Circuit) Ke Heatsink Pada Rangakaian Penguat Amplifier]]></title>
</titleInfo>
<name type="Personal Name" authority="">
<namePart>Efianus Djo Taga</namePart>
<role><roleTerm type="text">Pengarang</roleTerm></role>
</name>
<name type="Personal Name" authority="">
<namePart>ZET YULIUS BAITANU</namePart>
<role><roleTerm type="text">Dosen Pembimbing 2</roleTerm></role>
</name>
<name type="Personal Name" authority="">
<namePart>YETURSANCE YULSIANA MANAFE</namePart>
<role><roleTerm type="text">Dosen Pembimbing 1</roleTerm></role>
</name>
<name type="Personal Name">
<namePart>Zet Yulius Baitanu</namePart>
<role><roleTerm type="text">Penguji 1</roleTerm></role>
</name>
<name type="Personal Name">
<namePart>Ichsan Fahmi</namePart>
<role><roleTerm type="text">Penguji 2</roleTerm></role>
</name>
<name type="Personal Name">
<namePart>Yetursance Yulsiana Manafe</namePart>
<role><roleTerm type="text">Ketua Penguji</roleTerm></role>
</name>
<typeOfResource manuscript="yes" collection="yes"><![CDATA[mixed material]]></typeOfResource>
<genre authority="marcgt"><![CDATA[bibliography]]></genre>
<originInfo>
<place><placeTerm type="text"><![CDATA[Kupang]]></placeTerm></place>
<publisher><![CDATA[UPT Perpustakaan Undana]]></publisher>
<dateIssued><![CDATA[2022]]></dateIssued>
<issuance><![CDATA[monographic]]></issuance>
<edition><![CDATA[Published]]></edition>
</originInfo>
<language>
<languageTerm type="code"><![CDATA[id]]></languageTerm>
<languageTerm type="text"><![CDATA[Indonesia]]></languageTerm>
</language>
<itemType>
<itemTypeTerm type="code"><![CDATA[]]></itemTypeTerm>
<itemTypeTerm type="text"><![CDATA[]]></itemTypeTerm>
</itemType>
<copyright>
<copyrightTerm type="code"><![CDATA[2]]></copyrightTerm>
<copyrightTerm type="text"><![CDATA[Individu Penulis]]></copyrightTerm>
</copyright>
<physicalDescription>
<form authority="gmd"><![CDATA[Skripsi]]></form>
<extent><![CDATA[xiv+129 hlm]]></extent>
</physicalDescription>
<note></note>
<classification><![CDATA[832.01]]></classification><ministry><![CDATA[20201]]></ministry><studentID><![CDATA[1601130053]]></studentID><identifier type="isbn"><![CDATA[20211222]]></identifier><departementID><![CDATA[Pendidikan Teknik Elektro]]></departementID><urlCrossref><![CDATA[]]></urlCrossref><location>
<physicalLocation><![CDATA[Setiadi Repository UPT Perpustakaan Undana]]></physicalLocation>
<shelfLocator><![CDATA[832.01 Tag P]]></shelfLocator>
</location>
<slims:digitals>
<slims:digital_item id="7027" url="" path="/83201-S1-1601130053-2022-SKRIPSI.pdf" mimetype="application/pdf"><![CDATA[Pengaruh Penggunaan Thermal Pasta Terhadap Panas IC (Integrated Circuit) Ke Heatsink Pada Rangakaian Penguat Amplifier]]></slims:digital_item>
</slims:digitals><slims:image><![CDATA[cover-skripsi-pend-tek-elektro.png.png]]></slims:image>
<recordInfo>
<recordIdentifier><![CDATA[5142]]></recordIdentifier>
<recordCreationDate encoding="w3cdtf"><![CDATA[2022-01-29 22:52:07]]></recordCreationDate>
<recordChangeDate encoding="w3cdtf"><![CDATA[2022-02-14 12:10:10]]></recordChangeDate>
<recordOrigin><![CDATA[machine generated]]></recordOrigin>
</recordInfo></mods></modsCollection>